CVE-2023-33063
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
CVSS
—
No CVSS
EPSS
0.7%
p49
KEV
YES
Dec 5, 2023
Exploit Today
65
0-100
Published: — · Last modified: —
Product
Qualcomm / Multiple Chipsets
Vulnerability
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Added to KEV
Dec 5, 2023
Remediate by
Dec 26, 2023
Known ransomware use
No
Summary description
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
Required action
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Notes
This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110; https://nvd.nist.gov/vuln/detail/CVE-2023-33063