CVE-2023-33063
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
CVSS
—
Sem CVSS
EPSS
0.7%
p52
KEV
SIM
5 de dez. de 2023
Exploit Today
66
0-100
Publicado: — · Última mod.: —
Produto
Qualcomm / Multiple Chipsets
Vulnerabilidade
Qualcomm Multiple Chipsets Use-After-Free Vulnerability
Adicionado ao KEV
5 de dez. de 2023
Corrigir até
26 de dez. de 2023
Uso conhecido em ransomware
Não
Descrição resumida
Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.
Ação necessária
Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable.
Notas
This vulnerability affects a common open-source component, third-party library, or a protocol used by different products. Please check with specific vendors for information on patching status. For more information, please see: https://git.codelinaro.org/clo/la/kernel/msm-5.15/-/commit/2643808ddbedfaabbb334741873fb2857f78188a, https://git.codelinaro.org/clo/la/kernel/msm-4.14/-/commit/d43222efda5a01c9804d74a541e3c1be9b7fe110; https://nvd.nist.gov/vuln/detail/CVE-2023-33063